xMEMS Labs, pioneers in piezoMEMS technology and creators of the first all-silicon micro speakers, have announced their latest groundbreaking innovation: the xMEMS XMC-2400 µCooling chip. This is the first-ever active micro-cooling fan on a chip, designed for ultramobile devices and next-gen AI applications.
The XMC-2400 µCooling chip measures just 1 millimeter in thickness, enabling manufacturers to integrate active cooling into smartphones, tablets, and other mobile devices without adding bulk. This all-silicon, solid-state fan operates silently and without vibrations, offering a robust solution for thermal management in increasingly powerful mobile devices.
The chip’s compact design—measuring only 9.26 x 7.6 x 1.08 millimeters and weighing less than 150 milligrams – makes it 96% smaller and lighter than traditional cooling alternatives. Despite its size, it can move up to 39 cubic centimeters of air per second with 1,000Pa of back pressure, ensuring efficient cooling in even the smallest form factors.
xMEMS is set to start sampling the XMC-2400 in Q1 2025, with demonstrations planned for September at xMEMS Live events in Shenzhen and Taipei. The company expects this innovation to redefine thermal management in high-performance, AI-ready mobile devices.
