NVIDIA is preparing to launch a new line of graphics processors designed to accelerate artificial intelligence tasks. The Blackwell Ultra B300 series is set to succeed the popular Blackwell lineup, bringing a new level of performance.
Instead of moving to the next generation, NVIDIA has chosen to rename its existing Blackwell Ultra series. Now, the AI accelerators B200 Ultra and server solutions GB200 Ultra will be referred to as B300 and GB300, respectively. This decision will allow the company to better position its products and simplify identification for customers.
The new chips will feature up to 288 GB of high-performance HBM3e memory, significantly speeding up the processing of large data volumes and the training of complex neural networks. In comparison, competitors offer a maximum of 256 GB of memory.
NVIDIA will utilize 12-layer HBM3e memory and CoWoS-L technology to create a more efficient and powerful architecture, resulting in substantial performance gains over the previous generation.
The B300 lineup will include various configurations, including HGX, MGX, and NVL, allowing users to select the optimal solution for different tasks and computing scales.
Despite the upcoming release of the new lineup, demand for existing Blackwell models remains high. NVIDIA has already secured orders for the next 12 months, indicating strong market interest in its products.
The launch of Blackwell Ultra B300 will be a significant event for the artificial intelligence industry. The new graphics processors will enable researchers and developers to create more complex and efficient machine learning models and accelerate advancements in areas such as computer vision, natural language processing, and autonomous vehicles.
With increased memory capacity and improved architecture, the new chips are expected to provide a significant performance boost for AI tasks. The B300 series will offer various configurations, making it possible to find the optimal solution for a range of applications and computational scales.
| Nvidia Products Name and Key Specs (C) TrendForce | ||||
|---|---|---|---|---|
| Old Name | New Name | Major Server Sku | HBM Type | CoWoS Type |
| B 100 | B 100 | HGX | HBM3e 8hi*8 (192GB) | CoWoS-L |
| B 200 | B 200 | HGX | HBM3e 8hi*8 (192GB) | CoWoS-L |
| B 200 Ultra | B 300 | HGX | HBM3e 12hi*8 (288GB) | CoWoS-L |
| GB200 | GB200 | NVL72(main), NVL36 | HBM3e 8hi*8 (192GB) | CoWoS-L |
| GB200 Ultra | GB300 | NVL72(main), NVL36 | HBM3e 12hi*8 (288GB) | CoWoS-L |
| B200A Ultra | B300A | HGX, MGX | HBM3e 12hi*4 (144GB) | CoWoS-S |
| GB200A Ultra | GB300A | NVL36, MGX | HBM3e 12hi*4 (144GB) | CoWoS-S |
Preliminary reports suggest that the first products from the Blackwell Ultra B300 series will hit the market in the second or fourth quarter of 2025.
The Blackwell Ultra B300 promises to set a new standard in AI accelerators and open up new opportunities for the development of this promising technology.
