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AI Hardware Reviews Top Updated Oct 11, 6:22 PM GMT

AMD Instinct: AI Monster with 288 GB of Memory!

AMD has introduced revolutionary AI accelerators, Instinct MI325X and MI355X, which promise to transform the landscape of high-performance computing. Equipped with massive HBM3e memory and the latest architectures, these accelerators offer unprecedented performance, opening new horizons for AI research.

Instinct MI325X: 256 GB of Memory and Impressive Performance

amd instinct mi325x specs
(C) AMD

The announced MI325X accelerator comes with 256 GB of HBM3e memory, allowing it to process vast amounts of data at incredible speeds. The CDNA 3 architecture delivers up to 2.6 PFLOPs of computing power for FP8 and 1.3 PFLOPs for FP16, making it an ideal tool for the most demanding deep learning tasks.

amd instinct mi325x vs h200 hgx
(C) AMD

AMD claims significant superiority of the MI325X over competitors, showing up to 40% performance gains compared to the NVIDIA H200 in certain workloads.

amd instinct mi325x platform specs
(C) AMD

Servers equipped with multiple MI325X accelerators can provide even more impressive results, offering terabytes of memory and tens of petaflops of computing power.

MI355X: The Future is Here

amd instinct mi355x platform
(C) AMD

Next year, AMD plans to release an even more powerful accelerator, the MI355X. Based on the latest CDNA 4 architecture and built using a 3nm process, the MI355X will feature 288 GB of HBM3e memory and offer a significant performance boost compared to its predecessor.

Key Features of the MI355X:

  • Massive memory capacity: 288 GB HBM3e for handling the largest AI models.
  • New CDNA 4 architecture: Provides a substantial increase in performance and energy efficiency.
  • Support for new data formats: FP4 and FP6 for even greater computational accuracy.
  • High memory bandwidth: Up to 64 TB/s to speed up data transfer.

ROCm 6.2: Software Advancements

rocm 6.2
(C) AMD

Alongside hardware improvements, AMD continues to enhance its ROCm software. The new version 6.2 promises even higher performance in AI model training and inference tasks.

Conclusion

AMD is demonstrating impressive progress in high-performance computing, offering powerful AI accelerators that meet the needs of the most demanding researchers and developers. The Instinct MI325X and MI355X set new industry standards and open new opportunities for the advancement of artificial intelligence.

AMD Instinct AI Accelerators
Accelerator NameAMD Instinct MI400AMD Instinct MI350XAMD Instinct MI325XAMD Instinct MI300XAMD Instinct MI250X
GPU ArchitectureCDNA NextCDNA 4Aqua Vanjaram (CDNA 3)Aqua Vanjaram (CDNA 3)Aldebaran (CDNA 2)
GPU Process NodeTBD3nm5nm+6nm5nm+6nm6nm
GPU ChipletsTBD8 (MCM)8 (MCM)8 (MCM)2 (MCM) 1 (Per Die)
GPU CoresTBDTBD19,45619,45614,080
GPU Clock SpeedTBDTBD2100 MHz2100 MHz1700 MHz
INT8 ComputeTBDTBD2614 TOPS2614 TOPS383 TOPS
FP6/FP4 ComputeTBD9.2 PFLOPsN/AN/AN/A
FP8 ComputeTBD4.6 PFLOPs2.6 PFLOPs2.6 PFLOPsN/A
FP16 ComputeTBD2.3 PFLOPs1.3 PFLOPs1.3 PFLOPs383 TFLOPs
FP32 ComputeTBDTBD163.4 TFLOPs163.4 TFLOPs95.7 TFLOPs
FP64 ComputeTBDTBD81.7 TFLOPs81.7 TFLOPs47.9 TFLOPs
VRAMTBD288 HBM3e256 GB HBM3e192 GB HBM3128 GB HBM2e
Infinity CacheTBDTBD256 MB256 MBN/A
Memory ClockTBD8.0 Gbps?5.9 Gbps5.2 Gbps3.2 Gbps
Memory BusTBD8192-bit8192-bit8192-bit8192-bit
Memory BandwidthTBD8 TB/s6.0 TB/s5.3 TB/s3.2 TB/s
Form FactorTBDOAMOAMOAMOAM
CoolingTBDPassive CoolingPassive CoolingPassive CoolingPassive Cooling
TDP (Max)TBDTBD1000W750W560W
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